PRODUCTS
Ultrasonic dry cleaner for simultaneous cleaning on both sides VUV-HG / HGv
- High Pressure
- Ultrasonic
- Non-Contact
- # Web｜film_paper_metallic-foil
- # Flat-substrate
- # Spot
- # Semiconductor
- # Battery
- # Adhered-particles
- # Automobile
- Non-contact ultrasonic cleaner
using high-pressure compressed air - Removes firmly adhered particles
For Roll-to-Roll Process (such as films)
*Customized products according to the roll shape are available
For flat substrates
01Figure
02Test results
- Substrate
- Glass
- Pressure
- 1.0MPa
- Particles
- 5 μm spacer beads
- Distance between
the cleaning head and substrate - 1.5mm
- Line speed
- 100mm/sec
Adhered particle test
Heat the rear surface of the substrate for three minutes with a dryer (120°C) to firmly adhere particles.
Before cleaning
(After adhesion of particles)
After cleaning
Test results in SHINKO’s clean room. The removal rate may change depending on the particle type and test conditions.
03Applications
Film
Glass
Rechargeable
Battery
LCD/OLED
Semiconductor